Tekcem - Tekfon 5 Acoustic Underscreed Layer

TekcemSKU: BMD10856
filler

Price:
£169.74 Inc-Vat £141.45 Exc-Vat
Stock:
In Stock
TEKFON 5 is a resilient layer ideal for use under hard flooring materials such as wood or laminate.
It can also be used under a screed in conjunction with suitable isolating perimeter strips to provide acoustic separation between screed and structure.
TEKFON 5 is an extruded polyethylene sheet material available in rolls.

TEKFON 5 has been designed specifically to acoustically “isolate” the transmission of structure-borne vibrations (sound) between solid elements. Its closed cell structure is ideal at “cushioning” the vibrations.

TEKFON 5 has been engineered to comply with Building Regulation requirements for resilient layers in separating floors and can be used with a variety of structures and different screed types.
Excellent acoustic performance.
Very good compression resistance under load
Light and easy to handle.
Easy to install.
 Size: 1200mm x 93.75 x 5mm
Coverage: 112.4sqm
Data sheet download - Click Here

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